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Overview

As integrated circuits and electronic systems continue to grow in complexity—driven by emerging applications such as artificial intelligence, the Internet of Things, cloud computing, and automotive electronics—test technologies face increasing pressure to ensure quality, reliability, and scalability. In response to these growing challenges, global collaboration and knowledge sharing are becoming essential.

The 34th Asian Test Symposium (ATS) and the 9th International Test Conference in Asia (ITC-Asia) will be held in conjunction with SEMICON Japan 2025 in Tokyo, Japan. This joint event provides a valuable platform for academic researchers and industry professionals worldwide to present their latest results and exchange ideas in system, board, and device testing, as well as broader test technologies.

Joint Call for PapersPaper Submission

Key Dates

  • Paper submission deadline: July 22 August 5, 2025
  • Notification of acceptance: September 2 September 24, 2025
  • Camera-ready manuscript: October 2 October 24, 2025

Upcoming Event Highlights

Keynote 1

Title: New Design for Test Technologies for the Angstrom Era Multi-Die Designs

Speaker: Janusz Rajski (Vice President of Engineering, Tessent, Siemens EDA)

Partner Event