(Call for Papers (Latest Version; PDF))
We are excited to announce that the 34th Asian Test Symposium (ATS) and the 9th International Test Conference in Asia (ITC-Asia) will be held concurrently with SEMICON Japan 2025 in Tokyo, Japan. This unique joint event offers an unparalleled opportunity for academic researchers and industry professionals from around the world. They can share their latest findings and innovations in system, board, and device testing as well as in broader test technologies.
Topics of Interests include (but are not limited to) the following topics:
- AI test and Test for AI
- Analog/Mixed-Signal Test
- ATE Design
- Automatic Test Pattern Generation (ATPG)
- Autonomous Testing
- Board-Level Testing and Diagnosis
- Boundary Scan Test
- Built-In Self-Test (BIST)
- CPU/GPU Test
- Connectivity Testing
- Defect-Based Test
- Delay and Performance Test
- Dependability and Functional Safety
- Design Verification, Validation, and Debug
- Design for Testability (DFT)
- Diagnosis and Silicon Debug
- Fault Diagnosis and Failure Analysis
- Fault Modeling and Simulation
- Fault Tolerance
- Hardware Oriented Security and Trust
- High-Speed I/O Test
- Heterogeneous Testing
- Low-Power IC Test
- Machine Learning in Test
- Memory Test, Diagnosis, and Repair
- Multi-/Many-core Processor Test
- Online Test
- On-Chip Measurement
- Power/Thermal/Reliability Issues in Test
- Reconfigurable System Test
- Reliability and Testing for Emerging/Approximate/Quantum Computing
- RF Test
- Safety and Test for Automotive ICs
- Self-Repair • SiP, Chiplet, 2.5D and 3D IC Test
- Software Test and Reliability
- Standards in Test
- System-on-Chip Test
- Test Compression
- Test Economics
- Test Quality
- Test Synthesis
- Test for Biomedical Circuits and Systems
- Test for MEMS and Microfluidic Systems
- Test for Nanoscale Devices and Emerging Technologies
- Test for Reversible and Quantum Circuits
- Test for Sensors and IoT
- Yield Analysis, Learning, and Enhancement
The ATS/ITC-Asia 2025 Organizing Committee invites original, unpublished paper submissions on the above topics. Paper submission shall be complete manuscripts, not exceeding six pages in the standard two-column format. The submission will be considered evidence that upon acceptance the author(s) will submit a final camera-ready version of the paper for inclusion in the proceedings, and will present the paper at the symposium/conference. Each accepted contribution must have at least one full paid registration by the time the camera-ready paper is submitted for inclusion in the proceedings. ATS/ITC-Asia reserves the right to exclude papers from the official proceedings if they are not presented at the event.
Key Dates:
- Paper submission deadline:
July 22August 512 , 2025 - Notification of acceptance:
September 2September 24 , 2025 - Camera-ready manuscript:
October 2October 24 , 2025
Contact Information:
H. Ichihara and H. Yotsuyanagi, Program Co-Chairs
pc <at> ats-itc-asia2025.info.hiroshima-cu.ac.jp