CALL FOR PARTICIPATION

(Call for Participation (PDF))

We are pleased to announce ITC-Asia 2019 will take place in Tokyo Senju Campus of Tokyo Denki University (TDU) on September 3-5, 2019, Tokyo, Japan.

This year, we have organized 2 Tutorials, 2 Keynote Speeches, 3 Invited Talks, 10 Technical sessions, 2 Special Sessions, 1 Embedded Tutorial,  2 Industry Sessions, and Two days Exhibition. We would like to invite all interested Researchers, Engineers, Technologists, and Students to participate in ITC-Asia 2019.

Program Highlights:

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Tutorials:

■Machine Learning for Reliability of ICs and Systems

Mehdi Tahoori (Karlsruhe Institute of Technology)

Krishnendu Chakrabarty (Duke University)

■AI Chip Technologies and Its DFT Methodologies

Yu Huang, Rahul Singhal and Lee Harrison (Mentor, a Siemens Business)

Keynote Speeches:

■Highly Dependable Many-Processor Systems-on-Chip for Cars 

Hans G. Kerkhoff (University of Twente)

■AI-Baseball: Semiconductor, IOT, and the Sport Industry 

-Cheng-Wen Wu (National Tsing Hua University)

Invited Talks:

■IC Test – Where the Excitement Never Ceases to End 

-Rohit Kapu (Cadence Design Systems, Inc.)

■Semiconductor Device and Test in Data Explosion Period

-Shin Kimura (ADVANTEST CORPORATION)

■Implementation of Security Function utilizing Safety Verification Function for Collaboration of Security and Safety

  -Nobuyasu Kanekawa (Hitachi, Ltd.)

Special Sessions:

■The New High-Bandwidth Test Access Paradigm

-Steve Pateras (Synopsys, Inc.)

■Test Challenges and Solutions for AI, SoC DFT  Architecture and Next Level of Quality 

Yang, Wu (Mentor, a Siemens Business)

■High Quality and Low Cost Test for Mixed Signal SOCs 

Malav Shah (Texas Instruments, Inc)

ITC-India Excellent Papers

Technical Sessions: 30 papers

■Analog and Mixed-signal Test, ATE Design, Trust & Safety,

■Hardware Oriented Security, DFT, ATPG, Fault Tolerance,

■Hotspot Analysis/Yield Analysis, 3D IC Test/ SRAM BIST, Delay Test

Industry Sessions & Exhibitors:

■Synopsys, Inc.

■Mentor, a Siemens Business

■Cadence Design Systems, Inc.

■ADVANTEST CORPORATION

■Syswave Corp.

■ABLIC Inc.

■Renesas Electronics Corporation

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Registration:

Please click HERE to register for your participation

Early Registration Deadline: July 30, 2019,  Aug. 6, 2019

If you have any questions, please contact us.

Contact Information:

H. Ichihara and M. Ishida, Program Co-Chairs,

pc2019@itc-asia.info.hiroshima-cu.ac.jp