(Call for Participation (PDF))
We are pleased to announce ITC-Asia 2019 will take place in Tokyo Senju Campus of Tokyo Denki University (TDU) on September 3-5, 2019, Tokyo, Japan.
This year, we have organized 2 Tutorials, 2 Keynote Speeches, 3 Invited Talks, 10 Technical sessions, 2 Special Sessions, 1 Embedded Tutorial, 2 Industry Sessions, and Two days Exhibition. We would like to invite all interested Researchers, Engineers, Technologists, and Students to participate in ITC-Asia 2019.
Program Highlights:
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Tutorials:
■Machine Learning for Reliability of ICs and Systems
–Mehdi Tahoori (Karlsruhe Institute of Technology)
–Krishnendu Chakrabarty (Duke University)
■AI Chip Technologies and Its DFT Methodologies
–Yu Huang, Rahul Singhal and Lee Harrison (Mentor, a Siemens Business)
Keynote Speeches:
■Highly Dependable Many-Processor Systems-on-Chip for Cars
–Hans G. Kerkhoff (University of Twente)
■AI-Baseball: Semiconductor, IOT, and the Sport Industry
-Cheng-Wen Wu (National Tsing Hua University)
Invited Talks:
■IC Test – Where the Excitement Never Ceases to End
-Rohit Kapu (Cadence Design Systems, Inc.)
■Semiconductor Device and Test in Data Explosion Period
-Shin Kimura (ADVANTEST CORPORATION)
■Implementation of Security Function utilizing Safety Verification Function for Collaboration of Security and Safety
-Nobuyasu Kanekawa (Hitachi, Ltd.)
Special Sessions:
■The New High-Bandwidth Test Access Paradigm
-Steve Pateras (Synopsys, Inc.)
■Test Challenges and Solutions for AI, SoC DFT Architecture and Next Level of Quality
–Yang, Wu (Mentor, a Siemens Business)
■High Quality and Low Cost Test for Mixed Signal SOCs
–Malav Shah (Texas Instruments, Inc)
■ITC-India Excellent Papers
Technical Sessions: 30 papers
■Analog and Mixed-signal Test, ATE Design, Trust & Safety,
■Hardware Oriented Security, DFT, ATPG, Fault Tolerance,
■Hotspot Analysis/Yield Analysis, 3D IC Test/ SRAM BIST, Delay Test
Industry Sessions & Exhibitors:
■Synopsys, Inc.
■Mentor, a Siemens Business
■Cadence Design Systems, Inc.
■ADVANTEST CORPORATION
■Syswave Corp.
■ABLIC Inc.
■Renesas Electronics Corporation
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Registration:
Please click HERE to register for your participation
Early Registration Deadline: July 30, 2019, Aug. 6, 2019
If you have any questions, please contact us.
Contact Information:
H. Ichihara and M. Ishida, Program Co-Chairs,