We are pleased to announce that the 7th IEEE ITC-Asia will take place in Matsue, Shimane prefecture in Japan on September 12–14, 2023.

This year, we have organized two half-day tutorials, two keynote speeches, two invited talks, two 3D chiplet test sessions, three special/industry sessions, five industrial exhibitions, and several high-school student presentations. We would like to invite all interested Researchers, Engineers, Technologists, and Students to participate in ITC-Asia 2023!

The 18th D2T symposium will take place prior to ITC-Asia 2023. We sincerely hope that you will consider participating in both ITC-Asia and D2T symposium!

Program Highlights

Tutorials:

“Scalable hierarchical DFT technologies for AI, SOC and multi-die”
Lee Harrison and Wu Yang (Siemens EDA)

“Silicon Lifecycle Management: Trends, Challenges and Solutions”
Yervant Zorian (Synopsys, Inc.)

Keynote Speeches:

“Semiconductor Packaging Revolution in the Era of Chiplets”
Yasumitsu Orii (Rapidus Corporation)

“Technology for The Future of Computing”
Shintaro Yamamichi (IBM Japan, Ltd.)

Invited Talks:

“Moore Meets Murphy”
Erik Jan Marinissen (imec)

“Test Industry Challenges and Solutions as Observed by the Leading Physical Implementation Solution Provider”
Janet Olson (Cadence Design Systems, Inc.)

Regular Sessions: 20 papers (13 regular and 7 short presentations)

Hardware Security
Defect Analysis
Processor/Software Testing
Fault Tolerant Latch
Testing and Verification
Memory
Jitter and Error Mitigation

Special Sessions:

3D Chiplet Test Session 1&2
Siemens Session (Silicon Lifecycle Management)

Industry Sessions:

ADVANTEST CORPORATION
Cadence Design Systems, Inc.
King Yuan Electronics Co., Ltd, Taiwan
PRIVATECH Inc., Japan
Renesas Electronics Corporation
S.E.R. Corporation

Industry Exhibition:

Cadence Design Systems, Inc.
FormFactor Inc.
S.E.R Corporation
Siemens EDA
TAKAYA Corporation

Social Events:

Banquet in Yuushien Garden (Performance: Yasugibushi)

Registration

Please click HERE to register for your participation!

Early Registration Deadline: Aug. 24, 2023

If you have any questions, please contact us.

Contact Information

M. ARAI and S. KOMATSU, Program Co-Chairs
E-mail: pc2023 [at] itc-asia.info.hiroshima-cu.ac.jp